HP-350MD

Screen Printer

HP-350MD

 

특징

  • 0402 Chip, 0.3 Pitch QFP, Ø0.2MBGA 완벽 프린팅
  • Squeegee 정밀 압력 제어 시스템 (Load-Cell Control)
  • Machine CPK 측정 Software 기본 내장
  • Close-Loop Control 기능 (Screen Printer ⇔SPI)
  • 3단Conveyor 자동 폭 조절 기능
  • Free Size Stencil Change
  • Stencil Align & Work Table UP/DOWN System
  • Array PCB Inspection Software 기본 적용으로 FPCB공정 개선
  • Job File의 모든 Data 및 CPK Data 저장 기능의 MES (Traceability)
  • Solder 2D Inspection System
  • Cleaning시 Paper Winding 기능 (특허등록: 10-0843782)
  • 인쇄 구간별 속도,압력 제어로 고정도의 인쇄 품질 실현 (특허등록: 10-0505314)
  • Top Link와 Edge Guide를 이용한 완벽 PCB Clamp (특허등록: 10-0505315)
  • LED 전용 대형 PCB X-axis Moving System (특허등록: 10-1166789)

 

OPTION

  • Support Pin 자동 위치 설정 기능
  • Auto Solder Dispenser (Laser sensor로 솔더 높이 측정)
  • Dot Dispenser 기능
  • Mask, Paste, Squeegee Assembly ID 기능을 비교 가능한 Hand Barcode Reader System
  • 2D Barcode Reading System (Use Camera)
  • PCB 상면의 부품 감지 Sensor
  • High Speed Conveyor System 5sec
  • Temperature Control Unit

 

 

SPECIFICATION

항목 HP-350MD HP-620MD HP-520SPI HP-850SPI
Total System Alignment Accuracy and Repeatability 2.0Ckp@±25㎛ (±0.015 , 0.005) 2.0Cpk@±25㎛ 6-Sigma 2.0Ckp@±25㎛ (±0.015 , 0.005) 2.0Ckp@±25㎛ (±0.015 , 0.005)
Printing Alignment

Accuracy and Repeatability

2.0Ckp@±25㎛ (±0.015 , 0.005) 2.0Cpk@±25㎛ 6-Sigma 2.0Ckp@±25㎛ (±0.015 , 0.005) 2.0Ckp@±25㎛ (±0.015 , 0.005)
Cycle time

(W203 X 145mmPCB)

ExcludingPrinting 6sec

*Real Time 약 11sec

ExcludingPrinting 10sec

*Real Time 약 16sec

ExcludingPrinting 7sec

*Real Time 약 13sec

ExcludingPrinting 12sec

*Real Time 약 18sec

Stencil Frame Size

(Standard, L x W mm)

650 x 550 mm (L x W)

736 x 736 mm

800 x 736 mm

600 x 550 mm

650 x 550 mm

736 x 736 mm

736, 800, 860, 920, 1000, 1050(L)

x 736, 800(W) mm

PCB Size(L x W mm) 50 x 50 ~ 350 x 250 50 x 50 ~ 620 x 300 50x 50 ~ 520 x 420 70x70 ~ 850 x 450
Print Area (L x W mm) 50 x 50 ~ 350 x 250 50 x 50 ~ 620 x 300 50x 50 ~ 520 x 420 70x70 ~ 850 x 450
PCB Thickness 0.3 ~ 6.5mm 0.3 ~ 6.5mm 0.3 ~ 6.5mm 0.3 ~ 7.0mm
PCB Weight 2 kg 3 kg 2 kg 8 kg
PCB Warpage 0 ~ 4mm (IncThickness)
PCB Stopper Program에 의해 자동으로 Camera가 이동하여 정확한 위치에서 Board를 정지시킴
PCB Support 마그네틱Support Pin & Block / PCB “t”에 따른 높이 자동조절 / Support Pin 높이: 73.9mm

Vacuum Type 지지 가능(OPTION) / Auto Support Pin 사용 가능(OPTION)

PCB Clamping Top Link Clamping (0.8 ~ 6t) / Top Knife Clamping (0.2 ~0.8t) / Vacuum Type Possible
PCB Under Clearance 30mm
기판측면(Edge) 허용범위 Top Link Clamping: 제한 없음 / Top Knife Edge Clamping: 3mm / Vacuum Type: 제한 없음
Conveyor 폭 조절 Program (Automatic) *In/Out 3 Stage Conveyor (3단)
PCB 이송방향 좌 =>우, 우=>좌 (전면 기준, Standard) 좌 =>좌, 우 =>우
PCB Transfer Line 900±50mm
Squeegee Type Metal (스테인레스 합금강) 0.2t, 0.3t / Etching Blade, 다양한 Blade 종류/ User 선택사양
Squeegee Level method Self-Balancing
Squeegee Speed 10~ 200mm/sec (Inc 0.01mm/sec)
Squeegee Pressure Load-Cell 적용,

1 ~ 50kg/f (program)

Snap-off Distance: 0.0 ~ 20.0mm (Inc 0.01mm) / Speed: 0.1 ~ 200mm/sec (Inc 0.01mm/sec)
Vision Camera Interfaced Scan CCD *F.O.V 11mm x 8mm * 3-channel(LED light)
Vision Board ICT Vision Board apply(256 Gray Scale 8bit) EURESYS LIBRARY 적용
2D Inspection Paste On Pad – 미납 검출 (Standard)
Fiducials (인식마크) Video mode type recognition
Fiducials Size 0.4 ~ 5.0mm
Cleaning System Solvent + Paper + Vacuum Control을 Program Parameter에서 사용
Dimension(mm) 1310(L)x2275(W)x1477(H) 1690(L)x2600(W)x1477(H) 2115(L)x1625(W)x1457(H) 2550(L)x1915(W)x1485(H)
Machine Weight 2,050 kg 2,400 kg 1,500 kg 2,700 kg
Machine Power AC 220V, 50/60Hz, 6.0KW AC 220V, 50/60Hz, 6.0KW AC 220V, 50/60HZ, 6.0Kw AC 220V, 50/60HZ, 8.0Kw
Pneumatic (Air) 0.5Kg/f , 40NL/min
운영 Program 산업용 PC, Microsoft Windows 7, TFT-LCD Monitor 17”
Host Communication SMEMA Interface(Standard), TCP/IP(OPTION)

 

 

 

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